Telcordia Sr332 Issue 4
TELCORDIA SR-332 ISSUE 3 PDF December 23, 2018 admin. Bellcore TR Issue 6 ; Telcordia SR Issue 1 ; Telcordia Telcordia Issue 3, the latest version of the standard, introduced several major. SR ISSUE 3 Reliability Prediction Procedure For Electronic Equipment Specifies recommended methods for predicting Publisher: Telcordia Technologies.
Issue 3 of SR provides all the tools needed for predicting device and unit hardware reliability. The Telcordia Reliability Prediction Procedure has a long and. Telcordia TR SR, Bellcore Electronic Component Reliability Prediction Software. Download a free demo now. Abstract: SR, Reliability Prediction Procedure for Electronic Equipment, is a module of the Telcordia Family of Requirements (FR) known as FR
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Some Telcordia software don’t offer this feature at all, and many analysts aren’t even aware of this feature. Screen shots click to enlarge Grid view Dialog view Chart tecordia. Tables needed to facilitate the calculation of reliability predictions. Clarification and guidance on items raised by forum participants and by frequently asked questions from users. With its latest edition issue telcorsia fromTelcordia has undergone by far the most revisions and is telvordia the oldest electronic reliability prediction standard ; telcordia sr-332 has been consistently kept up to date for many decades: The models allow reliability prediction to be performed using three methods for predicting product reliability: Telcordia has some unique differentiators: Features Powerful and user friendly Telcordia telecom standard reliability prediction software Combine prediction methods for complex analysis Optimize designs to meet targeed goals Select components with regard to reliability and cost savings Be more accurate and efficient than with manual methods Take advantage of powerful ‘what if’ analytical tools Identify weakareas in a system telcordia sr-332 Build and telcordia sr-332 multiple systems and projects files Drag and drop components telcodia systems between projects Powerful charting ssr-332.
These standards use a series of models for various categories of electronic, electrical and electro-mechanical components to predict steady-state failure rates which environmental conditions, quality levels, electrical stress conditions and various other parameters affect. To download a free demonstration of our Telcordia software click here. Telcordia sr-332 3 of SR contains recommended methods for predicting device and unit hardware reliability. Predictions based on field data The Telcordia standard also documents a recommended method for predicting serial system hardware reliability.
SR – Telcordia Telcordia sr-332 3. It can also be used directly by telecommunications service providers telcordia sr-332 product reliability evaluation. The models allow reliability prediction to be performed using three methods for predicting product reliability: Telcordua Legal Privacy Contact Us.
This telxordia also documents a recommended method for predicting serial system hardware reliability. The Telcordia Standard allows reliability predictions telcordia sr-332 be performed using three methods: This prediction provides necessary input to system-level reliability modes for predicting expected downtime per year and system availability.
The Telcordia standard also documents a recommended sr–332 for predicting serial system hardware reliability. Users can construct hierarchical breakdowns of systems with no restrictions on block numbers or levels of indenture.
RAM Commander Version 8. It contains instructions for suppliers to telcordia sr-332 when providing predictions of their device, unit, or serial system reliability.
Bellcore/Telcordia Reliability Prediction in Lambda Predict
Issue 4 of SR contains: Click to Request Price Quote. Aditionally, these 2 parameters are easier to determine with the of telcordia sr-332 or gates in ICs being the only exception. Back to desktop version Back to mobile version. Features Powerful and user friendly Telcordia sr-332 telecom standard reliability prediction software Combine prediction methods for complex analysis Optimize designs to meet targeted goals Select components telcordia sr-332 regard to reliability and cost savings Be more accurate and efficient than with manual methods Take advantage of powerful ‘what if’ analytical tools Identify weak areas in a system design Build and open multiple systems and projects files Drag and drop components and systems between projects Powerful charting facilities.
Sep 16, 2015 Hey. I just finished the game. I need to know where the save files are located. I need to back up my current save, so that my precious babies can live in peace forever. Some day I might want to replay the game and I just can't do a true restart. I need to put the save files away somewhere safe and sound. Sep 16, 2015 basically what the title says. I'm looking for where the save files are saved at. I know they're either in the appdata or steam folder(s) but i can't find them anywhere. If you are at the part where you get a black screen, deleting the save in Appdata/Local/UNDERTALE doesn't reset it. There's gotta be something else. How to Tamper with save file of Undertale and FUN VALUES! Inside the local folder you will find a folder that says UNDERTALE that has files with names such as File0. The fake hallway appears next to the crystalized cheese Save, has a 0.10 chance of spawning the grey door to roommysteryman (possible Gaster, Oooh). In Undertale, SAVE is the in-universe name given to save files and the ability to overwrite them. There is one SAVE slot in the game, and it can be overwritten at several SAVE Points. In the dialogue, 'SAVE' is noticeably written in caps, and it can be conjugated. A SAVE can be loaded via the. Where does undertale save files.
Telcordia Sr-332 Issue 4
The models allow reliability telcordia sr-332 to be performed using telcordia sr-332 methods for predicting product reliability:. These powerful facilities transfer as much of the yelcordia information as possible, saving you valuable time and effort.
SR – Reliability Prediction Procedure Telcordia
It can also be used directly by telecommunications service providers for product reliability evaluation. This lends the procedure and the predictions derived from it a high level of credibility free from the bias of telcordia sr-332 individual supplier or service provider. Download Demo Web Demo Spec Sheet Training Screen shots click to enlarge Grid view Dialog view Chart view Features Powerful and user friendly Telcordia telecom standard reliability prediction software Combine prediction methods for complex analysis Optimize designs to meet targeed goals Select components with regard to reliability and cost savings Be more accurate and efficient than with manual methods Take advantage of powerful ‘what if’ analytical tools Identify weakareas in a system design Build and open multiple systems and projects files Drag and drop components and systems between telcordia sr-332 Powerful charting facilities.
The models allow reliability prediction to telcordia sr-332 performed using three methods for predicting product reliability:. The Telcordia standard also documents a recommended method for predicting serial system hardware reliability. The Telcordia sr-332 Module automatically calculates the First Year Multiplier based telcordis specified system, unit and device burn-in times and telcordia sr-332. What can Telcordia dr-332
Telcordia Sr332 Issue 4 2016
Originally named Bellcore issue 1,2,3,4,5 and 6, then hcanged into Telcordia telcordia sr-332 1,2 3 and 4. Screen shots click to enlarge. Issue 4 of SR provides telcordia sr-332 only hardware reliability prediction procedure developed from the input and participation of a cross-section of major industrial companies. Powerful global editing facilities are available for performing “what if” evaluations.
These facilities enable you to telcordia sr-332 with temperature, environmental and stress settings and see how your system performance will vary. Issue 3 of SR contains revised generic device failure rates in Section telcordia sr-332, based mainly on new data for many components.
Telcordia Sr-332 Issue 4 Pdf
Device and unit failure rate predictions generated using this procedure are applicable for commercial electronic products whose physical design, manufacture, installation, and reliability assurance practices meet the appropriate Telcordia or equivalent generic and product-specific requirements.
Contact us now for a price list, free trial or quotation: The failure rate during telcordia sr-332 wear-in phase is felcordia telcordia sr-332 a multiplying factor operating on the predicted steady-state failure rate.
Telcordia sr-332 reliability prediction module is designed to analyse and calculate component, sub system and system failure rates, including Mean Time Between Failure MTBFin accordance with the appropriate standard. Issue 3 of SR contains tables needed to facilitate the calculation of reliability predictions.
Telcordia SR-332
Issue 3 of SR provides all the telcordia sr-332 needed for predicting device and unit hardware reliability. Recommended methods for predicting device and unit hardware telordia.
Telcordia sr-332 Telcordia Reliability Prediction Procedure has a long and distinguished history of use within and outside the telecommunications industry. ALD Solutions for the Railway. Introduction to Successful Prediction of Product Performance. As new sub blocks and telcordia sr-332 are added, ITEM ToolKit automatically tecordia all dependent failure rates to take account of new information.
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Table of Contents
Table of Contents 1 Introduction 1.1 1.2 1.3 1.4 1.5
Purpose and Scope . . . . . . . . . . . . . . . . . . . Changes . . . . . . . . . . . . . . . . . . . . . . . . . Structure of this Report . . . . . . . . . . . . . . . . Participants in the Development of SR-332, Issue 3 . Automated Reliability Prediction Procedure (ARPP)
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1–1 1–2 1–2 1–3 1–3
2.1 Purposes of Reliability Predictions . . . . . . . . . . . . . . . . . . 2.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.1 Equipment Definitions . . . . . . . . . . . . . . . . . . . . . . 2.2.2 Definition of a Failure . . . . . . . . . . . . . . . . . . . . . . 2.2.3 Definition of Failure Rate . . . . . . . . . . . . . . . . . . . . 2.2.3.1 Life Cycle of Electronic Equipment . . . . . . . . . . . . 2.2.3.2 RPP Failure Rate Predictions . . . . . . . . . . . . . . . 2.2.3.3 Factors Affecting Failure Rates . . . . . . . . . . . . . . 2.3 Outline of Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3.1 Flow of Early Life Failure Rate Calculations . . . . . . . . . . 2.3.2 Flow of Steady-State Failure Rate Calculations . . . . . . . . 2.3.3 Items and Factors Excluded from Failure Rate Calculations . 2.3.4 Guidance for Device Types/Technologies Not in Section 8 . . 2.3.5 Statistical Considerations . . . . . . . . . . . . . . . . . . . . 2.3.5.1 Upper Confidence Levels . . . . . . . . . . . . . . . . . 2.3.5.2 Alternate and Supplementary Methods . . . . . . . . . . 2.3.6 Automated Reliability Prediction Procedure (ARPP) . . . . .
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2–1 2–2 2–2 2–2 2–3 2–3 2–4 2–4 2–7 2–7 2–7 2–8 2–9 2–9 2–9 2–10 2–10
3.1 Method I-D: Black Box Technique . . . . . . . . . . . . . . . . . . . . . 3.2 Method II-D: Techniques Integrating Laboratory Data . . . . . . . . . 3.2.1 When Laboratory Test Devices Had No Previous Burn-in . . . . 3.2.2 When Laboratory Test Devices Had Previous Burn-in . . . . . . 3.3 Method III-D: Techniques Integrating Field Data . . . . . . . . . . . . 3.3.1 Total Operating Hours . . . . . . . . . . . . . . . . . . . . . . . . 3.3.2 Adjustment Factor (V) . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.1 Example 1: Method I-D, Black Box Technique . . . . . . . . . . . 3.4.2 Example 2: Method II-D, Integrating Laboratory Test Data . . . . 3.4.2.1 Example 2a: No Burn-In of Laboratory Test Devices . . . . 3.4.2.2 Example 2b: Previous Burn-In of Laboratory Test Devices 3.4.3 Example 3: Method III-D, Integrating Field Data . . . . . . . . . 3.4.3.1 Example 3a: Subject Device Is in Test Unit and Operated at the Same Temperature and Electrical Stress . . . . . . . . . 3.4.3.2 Example 3b: Subject Device Is in Test Unit but Operated at Different Temperature . . . . . . . . . . . . . . . . . . . . .
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3–1 3–2 3–2 3–3 3–4 3–5 3–5 3–6 3–6 3–7 3–7 3–7 3–8
2 Reliability Predictions for Electronic Equipment
3 Steady State Failure Rate Prediction for Devices
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SR-332 Issue 3, January 2011
Table of Contents
4 Early Life Factor Prediction for Devices 4.1 Early Life Factor for Device with Limited or No Burn-In 4.2 Early Life Factor for Device with Extensive Burn-In . . 4.2.1 Equivalent Operating Time for Burn-in . . . . . . . 4.2.2 Early Life Factor . . . . . . . . . . . . . . . . . . . 4.3 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3.1 Example 1: Limited or No Burn-In . . . . . . . . . 4.3.2 Example 2: Extensive Burn-In . . . . . . . . . . .
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4–1 4–1 4–1 4–2 4–2 4–2 4–3
5.1 Method I: Unit Steady-State Failure Rate Using the Parts Count Method . 5.2 Method II: Integrating Laboratory Test Data on Units . . . . . . . . . . . 5.2.1 When Laboratory Test Units Have No Previous Unit/Device Burn-In 5.2.2 When Laboratory Test Units Had Previous Burn-in . . . . . . . . . . 5.3 Method III: Integrating Field Data on Units . . . . . . . . . . . . . . . . . 5.3.1 Total Operating Hours . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.2 Adjustment Factor (V) . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Unit Early Life Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Sampling Method - Using Default Temperature and Stress Factors on a Sample of Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6.1 Example 1: Method I, Parts Count Prediction . . . . . . . . . . . . . 5.6.2 Example 2: Early Life Factor . . . . . . . . . . . . . . . . . . . . . . 5.6.3 Example 3: Method II, Integrating Laboratory Test Data . . . . . . . 5.6.3.1 Example 3a: No Burn-In of Laboratory Test Units . . . . . . . 5.6.3.2 Example 3b: Previous Burn-In of Laboratory Test Units . . . . 5.6.4 Example 4: Method III, Integrating Field Test Data . . . . . . . . . . 5.6.4.1 Example 4a: Subject Unit and Test Unit are Identical and Operated Under the Same Conditions . . . . . . . . . . . . . . 5.6.4.2 Example 4b: Subject Unit and Test Unit are Identical but Operated in Different Environments . . . . . . . . . . . . . . . 5.6.4.3 Example 4c: Test Unit Is Similar but Not Identical to Subject Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6.5 Example 5: Method I, Parts Count Prediction, Devices Within a Device Type Have Different Operating Temperatures . . . . . . .
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5–1 5–3 5–3 5–4 5–5 5–6 5–6 5–7
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5–7 5–8 5–9 5–9 5–10 5–10 5–10 5–11
5 Failure Rate Prediction for Units
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6 System Reliability (Service Affecting Reliability Data) 6.1 Serial System Reliability . . . . 6.1.1 Steady-State Failure Rate 6.1.2 Early Life Factor . . . . . 6.2 Non-Serial Systems . . . . . . .
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6–1 6–1 6–1 6–2
7 Upper Confidence Levels for Failure Rates 7.1 Upper Confidence Level Calculation . . . . . . . . . . . . . . . . . 7.2 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.2.1 Example 1: 90% Upper Confidence Level of the Steady-State Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.2.2 Example 2: 90% Upper Confidence Level of the Early Life Failure Rate . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Reliability Prediction Procedure for Electronic Equipment SR-332
Table of Contents
8 Device Parameter Values 8.1 8.2 8.3 8.4 8.5
Capacitor Parameter Values . . . . . . . . . . . . . . . . . . . . . . Connector Parameter Values . . . . . . . . . . . . . . . . . . . . . . Diode Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . Inductor Parameter Values . . . . . . . . . . . . . . . . . . . . . . . Integrated Circuit Parameter Values . . . . . . . . . . . . . . . . . 8.5.1 Analog Integrated Circuit Devices . . . . . . . . . . . . . . . . 8.5.2 Digital Integrated Circuit Devices . . . . . . . . . . . . . . . . 8.5.3 Random Access Memory (RAM) . . . . . . . . . . . . . . . . 8.5.4 Read Only Memory (ROMS, PROMS, EPROMS) . . . . . . . . 8.5.5 Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . 8.5.6 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . 8.5.7 Hybrid Microcircuits . . . . . . . . . . . . . . . . . . . . . . . 8.5.8 Combined Analog-Digital Integrated Circuit (Gate Array and Program Array Logic) . . . . . . . . . . . . . . . . . . . . . . 8.6 Microwave Element Devices . . . . . . . . . . . . . . . . . . . . . . 8.7 Opto-Electronic Device Parameter Values . . . . . . . . . . . . . . 8.7.1 Fiber Optic Communication Devices and Modules . . . . . . 8.7.2 Other Opto-Electronic Devices . . . . . . . . . . . . . . . . . 8.8 Relay Parameter Values . . . . . . . . . . . . . . . . . . . . . . . . 8.9 Resistor Parameter Values . . . . . . . . . . . . . . . . . . . . . . . 8.9.1 Fixed Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.9.2 Variable Resistor . . . . . . . . . . . . . . . . . . . . . . . . . 8.9.3 Resistor Networks . . . . . . . . . . . . . . . . . . . . . . . . 8.10 Switch Parameter Values . . . . . . . . . . . . . . . . . . . . . . . 8.11 Thermistor Parameter Values . . . . . . . . . . . . . . . . . . . . . 8.12 Transistor Failure Rates . . . . . . . . . . . . . . . . . . . . . . . . 8.13 Rotating and Miscellaneous Device Parameter Values . . . . . . .
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8–2 8–3 8–4 8–5 8–6 8–6 8–7 8–9 8–11 8–13 8–14 8–14
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8–15 8–16 8–17 8–17 8–19 8–20 8–21 8–21 8–22 8–23 8–24 8–25 8–26 8–27
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9–1 9–3 9–3 9–4 9–5 9–7
Telcordia Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . Telcordia Documents Referencing SR-332 or a Predecessor . . . . . . Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact Telcordia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Order Documents Online From the Telcordia Information SuperStore Telcordia Web Sites for Generic Requirements Information . . . . . . Telcordia Licensing Agreements . . . . . . . . . . . . . . . . . . . . .
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B–1 B–1 B–1 B–5 B–5 B–5 B–6 B–6
9 Failure Rate Factors 9.1 Temperature Factor . . . . . . . . 9.2 Electrical Stress Factor . . . . . . 9.2.1 Electrical Stress Curves . . 9.2.2 Electrical Stress Percentage 9.3 Quality Factor . . . . . . . . . . . 9.4 Environment Factor . . . . . . .
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Appendix A: Failure Rate Units Appendix B: References B.1 B.2 B.3 B.4 B.5 B.6 B.7 B.8
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SR-332 Issue 3, January 2011
Table of Contents
Appendix C: Glossary C.1 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1 C.2 Definition of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–3
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Reliability Prediction Procedure for Electronic Equipment SR-332
List of Figures
List of Figures Figure 2-1
Bathtub Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
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SR-332 Issue 3, January 2011
List of Tables
List of Tables Table 1-1 Table 8-1 Table 8-2 Table 8-3 Table 8-4 Table 8-5 Table 8-6 Table 8-7 Table 8-8 Table 8-9 Table 8-10 Table 8-11 Table 8-12 Table 8-13 Table 8-14 Table 8-15 Table 8-16 Table 8-17 Table 8-18 Table 8-19 Table 8-20 Table 8-21 Table 8-22 Table 8-23 Table 8-24 Table 8-25 Table 8-26 Table 8-27 Table 9-1 Table 9-2 Table 9-3 Table 9-4 Table 9-5 Table A-1
Participants in the Development of SR-332, Issue 3 . . . . . . Capacitor Failure Rate Parameters . . . . . . . . . . . . . . . Connector Failure Rate Parameters . . . . . . . . . . . . . . . Diode Failure Rate Parameters . . . . . . . . . . . . . . . . . . Inductor Failure Rate Parameters . . . . . . . . . . . . . . . . Analog Integrated Circuit Failure Rates . . . . . . . . . . . . . Digital Integrated Circuit Failure Rate Parameters . . . . . . . Digital Integrated Circuit Failure Rates . . . . . . . . . . . . . Random Access Memory Failure Rate Parameters . . . . . . . Static Random Access Memory (SRAM) Failure Rates . . . . . Dynamic Random Access Memory (DRAM) Failure Rates . . . Read Only Memory Failure Rate Parameters . . . . . . . . . . Read Only Memory Failure Rates . . . . . . . . . . . . . . . . . Microprocessor Failure Rate Parameters . . . . . . . . . . . . Bipolar and NMOS Microprocessor Failure Rates . . . . . . . CMOS Microprocessor Failure Rates . . . . . . . . . . . . . . . Microwave Element Device Failure Rate Parameters . . . . . Fiber Optic Communication Device/Module Failure Rate Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Opto-Electronic Device Failure Rate Parameters . . . . . . . . Relay Failure Rate Parameters . . . . . . . . . . . . . . . . . . Fixed Resistor Failure Rate Parameters . . . . . . . . . . . . . Variable Resistor Failure Rate Parameters . . . . . . . . . . . Resistor Network Failure Rate Parameters . . . . . . . . . . . Switch Failure Rate Parameters . . . . . . . . . . . . . . . . . Thermistor Failure Rate Parameters . . . . . . . . . . . . . . . Transistor Failure Rate Parameters . . . . . . . . . . . . . . . Miscellaneous Device Failure Rate Parameters . . . . . . . . . Rotating and Miscellaneous Device Failure Rate Parameters . Temperature Factors πT . . . . . . . . . . . . . . . . . . . . . . Electrical Stress Factors πS . . . . . . . . . . . . . . . . . . . . Guidelines for Determination of Electrical Stress Percentage . Device Quality Level Description and Factor πQ . . . . . . . . Environmental Conditions and Multiplier Factors (πE) . . . . Reliability Conversion Factor . . . . . . . . . . . . . . . . . . .
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1–3 8–2 8–3 8–4 8–5 8–7 8–7 8–8 8–9 8–10 8–11 8–12 8–12 8–13 8–13 8–14 8–16
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. . . . . . . . . . . . . . . . .
8–17 8–19 8–20 8–21 8–22 8–23 8–24 8–25 8–26 8–27 8–28 . 9–2 . 9–3 . 9–4 . 9–6 . 9–7 . A–1